Tender for Industrial Training Institute - NTID 22989103
Industrial Training Institute
BARELI, Madhya Pradesh, India
NTID 22989103
- Opening Date : Tue 27th October, 2020
- Closing Date : Mon 26th October, 2020
- ₹ 1042500.00
- NTID 22989103
supply of electronics components - 2.4-2.5/4.9-5.875 ghz, 2.5dbi gain(typ) @5.8ghz vert./omnidirect. 2 way antenna(imp=50 , conn-rpsma), wireless half-mini pcie module 802.11 a/b/g/n/ac, 3.3v (2t2r, 2.4/5ghz, 867mbps), 36-75v i/p, 12v/10a o/p dc-dc conv, sb-th, (-36 to -75v) dc i/p, 3.3v/3.6a, 5v/0.15a o/p dc-dc conv (qb)with i2c i/f & power failure alarm, 3v, lithium battery, cr2032, 220ω, ±25% @100mhz, 450 milli amp, 0603 size chip ferrite bead - rohs, 600ω, ±25% @100mhz, 300 milli amp, 0.52ω dcr, 0402 sz chip ferrite bead - rohs, 600ω, ±25% @100mhz 2a, 0805 smd ferrite bead - rohs, 100v, 5.5a schottky rectifier d-pak (to-252aa, th.res: 3°c/w jc, -40°c to +150°c), 200v, 1a, ultra fast rectifier sma (do-214ac), tvs diode array 500w-pp, tsop (vbr=6v, vrwm=5v), 6v-vdrm, 25v-vs sidactor (tvs) do-214aa (20a-itsm), iec61000-4-2 esd tvs diode array, sot-23-6 (15kv air,8kv contact, 5vwm, 14.5vc, 350w,-55 to 150°c), 140v 500a protection device, do-214aa-2 (-40 to 85°c), 14v / 10mm metal oxide varistor, 100v, 200ma,dual diode, common cathode, sot- 23,pbf, 5.1v, 500mw, zener diode sod-123 (4.85 - 5.3v, 50 micro amp, leak:10 micro amp @ 3v, -55 to +150°c), 630 milli amp, very fast blow, nano fuse smd, rohs, 10a, very fast blow, nano fuse smd, rohs, 8a slow-blow halogen free smd fuse, 12a slowblow halogen free smd fuse, 2c/o 2 coil latching 12v miniature relay-th, 1μh, ±20%, 1a, 0.06ω dcr, 1210 size chip inductor - rohs, 1μh, ±30%, 220 milli amp, 0805 smd chip inductor - rohs, 1.5μh, ±20%, 2.30a isat smd inductor, 22nh, ±5%, 300 milli amp, 0.6 ohm dcr, chip inductor, smd - rohs, 47μh,±10%,1210sz chip inductor (pb free), 47μh, ±20%, 70 milli amp chip inductor, 10μh, ±20%, 2.38a idc, 0.05ω dcr smd inductor (pb-free), 10μh, ±20%, 3a isat smd power inductor (pb-free), 1 1.5μh, ±30%, 4a, smd power inductor - rohs, 2.2μh, ±20%, 13a isat, smd power inductor - rohs, 3.3μh, ±20%, 3.3 amp isat smd inductor - rohs, 0.015-0.024 ohm, 5a i hold@25°c ptc thermistor-th, 0.12-0.19ω, 1.35a i hold @ 20°c ptc thermistor-th, 22 ω, ±5%, 0402 size, ntc thermister - smd, 1 kω, ±3%, 0402 size, ntc thermister - smd, 75v dc spark over voltage 3 electrode gdt-smd, 1:1 tr, 1.2 milli henry t1/cept single line interface transformers - smd, 1ct:2ct, 1.2 milli henry t1/cept single line interface transformers - smd, 1000 base-t 4 ch, 1:1 magnetic\ module - rohs, cable assembly, smaufl connector, bulkhead, 220mm length, cable assembly usb 2.0 type amicro type b 2m long, adhesive wire clamp (12.7x12.7), berg stick d/r, straight, 3mm tail length, rohs, fibre optic adaptor, sc/apc type, simplex ceramic, connector, sfp+, host board, 20p smt 0.8mm pitch, fibre optic patch cord, fcupc to sc-upc, sm, 2mm cable dia, 20mtr length, simplex, sfp+ cage 1x4 with pin type heat sink, with emi springs, press fit, conn power atca 34p female st pcb mount press fit, conn, hmzd, fml, 80p, r/a, rohs, conn hmzd male 80p st rohs, modular jack, rj11, 6p4c, short length, unshielded, conn. rj45 mod jack, 8p8c r/a cat5, with led gn+yl, conn, mod. jack, tab down rj45 1x4, 10/100/1000 base-t with integrated magnetics & leds green/yellow, micro header dual row smt 1.27mm pitch st 10p with polarising key, connector shrouded header male 2.54mm pitch 16pin smd, conn. usb fml r/a, "b" type rohs, conn. usb 'a' type, fml, r/a, double decker, atca guide modulebackplane- a1, rear alignment, post atcabackplne- ra1, dip switch, half pitch, smd, 10 way, snap action switch, pcb mount r/a, rohs, 11.1 mmactuator height, snap action switch, pcb mount r/a, vertical, rohs 3.15mm actuator height, snap action dual stacked tactile switch with blue led vertical r/a, socket dimm ddr3 240 circuits ultra low profile vertical entry, mini pci connector, 52 pins, 4mm height, 0.8mm pitch, smd, end sleeve for cable 4 sq mm, grey, heat sink 19x19x10mm with thermal adhesive, heat sink assembly with push pins, springs and thermal interface 30 x 30 mm, 15mm height, heat sink assembly with push pins, springs and thermal interface 35 x 35 mm, 10mm height
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